Statistical Evaluation of Electromigration Reliability at Chip Level
- 期刊名称IEEE Transactions on Device and Materials Reliability
- 作者Li, Baozhen; McLaughlin, Paul S.; Bickford, Jeanne Paulette; Habitz, Peter; Netrabile, Dileep; Sullivan, Timothy D.
- 卷第11卷
- 期第1期
- 印刷ISSN1530-4388
- 电子ISSN1558-2574
- 文件大小202.43KB
- 发表时间2011-03
- DOI10.1109/tdmr.2010.2093526
- 页码86-91
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