Modeling of copper wire bonding process on high power LEDs
- 作者Zhaohui Chen; Yong Liu; Sheng Liu
- 卷第51卷
- 期第1期
- 印刷ISSN0026-2714
- 文件大小1189.71KB
- 发表时间2011
- DOI10.1016/j.microrel.2010.03.001
- 页码171-178
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