[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Optimization of breaking processes in LTCC manufacturing
- 作者Horvath, Eszter; Erenyi, Andras; Geczy, Attila; Harsanyi, Gabor
- 文件大小1016.83KB
- 发表时间2011
- DOI10.1109/siitme.2011.6102708
- 页码153-155