[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Process and material effects on BGA board level solder joint reliability
- 作者Meyer, Sebastian; Metasch, Rene; Schwerz, Robert; Wohlrabe, Heinz; Wolter, Klaus-Jurgen
- 文件大小2080.88KB
- 发表时间2011
- DOI10.1109/eptc.2011.6184471
- 页码497-502
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