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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

Zhang, Lei; Lu, Xiuzhen; Luo, Xin; Carlberg, Bjorn; Zandira, Masoud; Ye, Lilei; Liu, Johan
  • 作者Zhang, Lei; Lu, Xiuzhen; Luo, Xin; Carlberg, Bjorn; Zandira, Masoud; Ye, Lilei; Liu, Johan
  • 文件大小1008.99KB
  • 发表时间2011
  • DOI10.1109/icept.2011.6066869
  • 页码1-4
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