[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures
Zhang, Lei; Lu, Xiuzhen; Luo, Xin; Carlberg, Bjorn; Zandira, Masoud; Ye, Lilei; Liu, Johan
- 作者Zhang, Lei; Lu, Xiuzhen; Luo, Xin; Carlberg, Bjorn; Zandira, Masoud; Ye, Lilei; Liu, Johan
- 文件大小1008.99KB
- 发表时间2011
- DOI10.1109/icept.2011.6066869
- 页码1-4