Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement
Bea, Jichel; Lee, Kangwook; Fukushima, Takafumi; Tanaka, Tetsu; Koyanagi, Mitsumasa
- 期刊名称IEEE Electron Device Letters
- 作者Bea, Jichel; Lee, Kangwook; Fukushima, Takafumi; Tanaka, Tetsu; Koyanagi, Mitsumasa
- 卷第32卷
- 期第7期
- 印刷ISSN0741-3106
- 电子ISSN1558-0563
- 文件大小354.10KB
- 发表时间2011-07
- DOI10.1109/led.2011.2141109
- 页码940-942