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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

Murata, Naokazu; Saito, Naoki; Endo, Fumiaki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 作者Murata, Naokazu; Saito, Naoki; Endo, Fumiaki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 文件大小3030.72KB
  • 发表时间2011
  • DOI10.1109/ectc.2011.5898811
  • 页码2119-2125
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