Comparison of the copper and gold wire bonding processes for LED packaging
- 期刊名称Journal of Semiconductors
- 作者Chen, Zhaohui; Liu, Yong; Liu, Sheng
- 卷第32卷
- 期第2期
- 印刷ISSN1674-4926
- 文件大小710.70KB
- 发表时间2011-02
- DOI10.1088/1674-4926/32/2/024011
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