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[ACM Press the 24th symposium - João Pessoa, Brazil (2011.08.30-2011.09.02)] Proceedings of the 24th symposium on Integrated circuits and systems design - SBCCI '11 - Packaging issues for 22nm and beyond

[ACM Press the 24th symposium - João Pessoa, Brazil (2011.08.30-2011.09.02)] Proceedings of the 24th symposium on Integrated circuits and systems design - SBCCI '11 - Packaging issues for 22nm and beyond

Feger, Claudius

作者Feger, Claudius
文件大小348.97KB
发表时间2011
DOI10.1145/2020876.2020930

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