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Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process

Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process

Y. Jiao; Y. A. Sampurno; Y. Zhuang; X. Wei; A. Meled; A. Philipossian

作者Y. Jiao; Y. A. Sampurno; Y. Zhuang; X. Wei; A. Meled; A. Philipossian
文件大小1190.92KB
发表时间2011
DOI10.1143/JJAP.50.05EC02

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