[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
Murata, Naokazu; Saito, Naoki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
- 作者Murata, Naokazu; Saito, Naoki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
- 文件大小2738.53KB
- 发表时间2011
- DOI10.1115/ipack2011-52048
- 页码677-684