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[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo

作者Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
文件大小761.81KB
发表时间2011
DOI10.1115/IPACK2011-52058
页码685-690

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