Crystal Structure of Human Enterovirus 71
- 期刊名称Science
- 作者Plevka, P.; Perera, R.; Cardosa, J.; Kuhn, R. J.; Rossmann, M. G.
- 卷第336卷
- 期第6086期
- 印刷ISSN0036-8075
- 电子ISSN1095-9203
- 文件大小486.59KB
- 发表时间2012-06-08
- DOI10.1126/science.1218713
- 页码1274-1274
同标题推荐
Effect of the Tantalum Barrier Layer on the Electromigration and Stress Migration Resistance of Physical-Vapor-Deposited Copper InterconnectChin, Yu-Lung; Chiou, Bi-Shiou; Wu, Wen-Fa · Japanese Journal of Applied Physics · 2002
[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Effect of Wire Thickness on Electromigration and Stress Migration Lifetime of CuChristiansen, Cathryn; Gambino, Jeff; Therrien, Joe; Hunt, Doug; Gill, Jason · 2006