Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

• 作者Xiaoyun Cui; David A. Hutt; Paul P. Conway
• 卷第520卷
• 期第19期
• 印刷ISSN0040-6090
• 文件大小753.05KB
• 发表时间2012
• DOI10.1016/j.tsf.2012.05.068