[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Mechanical and electrical reliability of copper interconnections for 3DIC
Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
- 作者Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
- 文件大小665.71KB
- 发表时间2012
- DOI10.1109/3dic.2012.6262998
- 页码1-6