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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Mechanical and electrical reliability of copper interconnections for 3DIC

[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Mechanical and electrical reliability of copper interconnections for 3DIC

Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 作者Saito, Naoki; Murata, Naokazu; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 文件大小665.71KB
  • 发表时间2012
  • DOI10.1109/3dic.2012.6262998
  • 页码1-6
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