Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping
- 期刊名称Journal of Electronic Packaging
- 作者Roberts, Jordan C.; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep
- 卷第134卷
- 期第3期
- 印刷ISSN1043-7398
- 文件大小18878.05KB
- 发表时间2012
- DOI10.1115/1.4006910
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