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[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Modeling of coupled TSVs in 3D ICs

[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Modeling of coupled TSVs in 3D ICs

Engin, A. Ege; Raghavan, N. Srinidhi
  • 作者Engin, A. Ege; Raghavan, N. Srinidhi
  • 文件大小401.19KB
  • 发表时间2012
  • DOI10.1109/isemc.2012.6351759
  • 页码7-11
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