[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Modeling of coupled TSVs in 3D ICs
Engin, A. Ege; Raghavan, N. Srinidhi
- 作者Engin, A. Ege; Raghavan, N. Srinidhi
- 文件大小401.19KB
- 发表时间2012
- DOI10.1109/isemc.2012.6351759
- 页码7-11