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[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - High-efficient and high-accurate chip to wafer bonding for size-free MEMS-IC integration by using fine patterned self-assembled monolayer

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - High-efficient and high-accurate chip to wafer bonding for size-free MEMS-IC integration by using fine patterned self-assembled monolayer

Lu, Jian; Nakano, Yuta; Takagi, Hideki; Maeda, Ryutaro
  • 作者Lu, Jian; Nakano, Yuta; Takagi, Hideki; Maeda, Ryutaro
  • 文件大小891.18KB
  • 发表时间2012
  • DOI10.1109/iitc.2012.6251580
  • 页码1-3
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