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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Development of low temperature Chip-on-Flex (COF) bonding process of 100°C

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Development of low temperature Chip-on-Flex (COF) bonding process of 100°C

Kim, Sun-Chul; Kim, Young-Ho

作者Kim, Sun-Chul; Kim, Young-Ho
文件大小495.27KB
发表时间2012
DOI10.1109/emap.2012.6507904
页码1-3

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