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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Measurement of die stresses in microprocessor packaging due to thermal and power cycling

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Measurement of die stresses in microprocessor packaging due to thermal and power cycling

Roberts, Jordan; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep
  • 作者Roberts, Jordan; Motalab, Mohammad; Hussain, Safina; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep
  • 文件大小1650.07KB
  • 发表时间2012
  • DOI10.1109/ectc.2012.6248918
  • 页码756-770
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