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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - TIM1 reliability of polymer solder

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - TIM1 reliability of polymer solder

Nguyen, My; Brandi, Jason

作者Nguyen, My; Brandi, Jason
文件大小300.48KB
发表时间2012
DOI10.1109/itherm.2012.6231565
页码1250-1254

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