Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration

• 期刊名称IEEE Electron Device Letters
• 作者Lee, Kangwook; Tani, Takaharu; Naganuma, Hideki; Ohara, Yuki; Fukushima, Takafumi; Tanaka, Tetsu; Koyanagi, Mitsumasa
• 卷第33卷
• 期第9期
• 印刷ISSN0741-3106
• 电子ISSN1558-0563
• 文件大小364.21KB
• 发表时间2012-09
• DOI10.1109/led.2012.2202631
• 页码1297-1299