Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation
- 期刊名称IEEE Transactions on Electron Devices
- 作者Fukushima, Takafumi; Iwata, Eiji; Ohara, Yuki; Murugesan, Mariappan; Bea, Jichoel; Lee, Kangwook; Tanaka, Tetsu; Koyanagi, Mitsumasa
- 卷第59卷
- 期第11期
- 印刷ISSN0018-9383
- 电子ISSN1557-9646
- 文件大小1045.86KB
- 发表时间2012-11
- DOI10.1109/ted.2012.2212709
- 页码2956-2963
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