Low Warpage Coreless Substrate for IC Packages

Kurashina, Mamoru; Mizutani, Daisuke; Koide, Masateru; Watanabe, Manabu; Fukuzono, Kenji; Itoh, Nobutaka; Suzuki, Hitoshi

期刊名称Transactions of The Japan Institute of Electronics Packaging
作者Kurashina, Mamoru; Mizutani, Daisuke; Koide, Masateru; Watanabe, Manabu; Fukuzono, Kenji; Itoh, Nobutaka; Suzuki, Hitoshi
卷第5卷
期第1期
印刷ISSN1883-3365
电子ISSN1884-8028
文件大小1663.25KB
发表时间2012
DOI10.5104/jiepeng.5.55
页码55-62

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