Flip-Chip Bonding Technologies with Low Melting Point Solders
- 期刊名称Journal of Smart Processing
- 作者YAMANAKA, Kimihiro
- 卷第1卷
- 期第3期
- 印刷ISSN2186-702X
- 文件大小703.07KB
- 发表时间2012
- DOI10.7791/jspmee.1.114
- 页码114-119
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