The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn–3.5Ag eutectic solder
- 作者Mevlüt Şahin; Emin Çadirli
- 卷第23卷
- 期第2期
- 印刷ISSN0957-4522
- 电子ISSN1573-482X
- 文件大小781.33KB
- 发表时间2012-02
- DOI10.1007/s10854-011-0422-x
- 页码484-492
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