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Overstress accommodation in notched woven-ply thermoplastic laminates at high-temperature: Numerical modeling and validation by Digital Image Correlation

Overstress accommodation in notched woven-ply thermoplastic laminates at high-temperature: Numerical modeling and validation by Digital Image Correlation

B. Vieille; J. Aucher; L. Taleb

作者B. Vieille; J. Aucher; L. Taleb
卷第45卷
期第1期
文件大小2954.75KB
发表时间2013
DOI10.1016/j.compositesb.2012.06.015

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