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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Size-free MEMS-IC high-efficient integration by using carrier wafer with self-assembled monolayer (SAM) fine pattern

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Size-free MEMS-IC high-efficient integration by using carrier wafer with self-assembled monolayer (SAM) fine pattern

Lu, Jian; Takagi, Hideki; Nakano, Yuta; Maeda, Ryutaro

作者Lu, Jian; Takagi, Hideki; Nakano, Yuta; Maeda, Ryutaro
文件大小1045.39KB
发表时间2013
DOI10.1109/ECTC.2013.6575771
页码1508-1513

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