发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Copper-Based Conductive Composites with Tailored Thermal Expansion

Copper-Based Conductive Composites with Tailored Thermal Expansion

Della Gaspera, Enrico; Tucker, Ryan; Star, Kurt; Lan, Esther H.; Ju, Yongho Sungtaek; Dunn, Bruce
  • 期刊名称ACS Applied Materials & Interfaces
  • 作者Della Gaspera, Enrico; Tucker, Ryan; Star, Kurt; Lan, Esther H.; Ju, Yongho Sungtaek; Dunn, Bruce
  • 卷第5卷
  • 期第21期
  • 印刷ISSN1944-8244
  • 电子ISSN1944-8252
  • 文件大小4826.75KB
  • 发表时间2013-11-13
  • DOI10.1021/am403227c
  • 页码10966-10974
← 返回【学霸图书馆】主页