Thermal Analysis of Porous Pin Fin used for Electronic Cooling
- 期刊名称Procedia Engineering
- 作者Bhanja, Dipankar; Kundu, Balaram; Mandal, Pabitra Kumar
- 卷第64卷
- 印刷ISSN1877-7058
- 文件大小343.92KB
- 发表时间2013
- DOI10.1016/j.proeng.2013.09.172
- 页码956-965
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