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[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal characterization of multichip structures

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal characterization of multichip structures

Ender, Ferenc; Hantos, Gusztav; Schweitzer, Dirk; Szabo, Peter G.

作者Ender, Ferenc; Hantos, Gusztav; Schweitzer, Dirk; Szabo, Peter G.
文件大小915.02KB
发表时间2013
DOI10.1109/therminic.2013.6675241
页码319-322

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