High-Efficient Chip to Wafer Self-Alignment and Bonding Applicable to MEMS-IC Flexible Integration

• 期刊名称IEEE Sensors Journal
• 作者Lu, Jian; Nakano, Yuta; Takagi, Hideki; Maeda, Ryutaro
• 卷第13卷
• 期第2期
• 印刷ISSN1530-437X
• 电子ISSN1558-1748
• 文件大小793.29KB
• 发表时间2013-02
• DOI10.1109/jsen.2012.2225422
• 页码651-656