[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias
- 作者Dixit, Pradeep; Viljanen, Heikki; Salonen, Jaakko; Suni, Tommi; Molarius, Jyrki; Monnoyer, Philippe
- 文件大小1033.73KB
- 发表时间2013
- DOI10.1109/impact.2013.6706634
- 页码190-193
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