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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - R1 — A reliability comparison study between 14 lead free alloys

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - R1 — A reliability comparison study between 14 lead free alloys

Wohlrabe, Heinz; Reichelt, Gundolf

作者Wohlrabe, Heinz; Reichelt, Gundolf
文件大小2496.13KB
发表时间2013
DOI10.1109/eptc.2013.6745730
页码292-297

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