[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal design for high power arrayed LED heat-dissipating system
- 作者Hsu, Hsiang-Chen; Wu, Shih-Jeh; Li, Jyun-Yi; Su, Jing-Wen; Huang, Jian-Siang; Fu, Shen-Li
- 文件大小1266.43KB
- 发表时间2013
- DOI10.1109/impact.2013.6706685
- 页码222-225
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