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[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Corrosion failure analysis about package box of aluminum silicon alloy used for microwave module

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Corrosion failure analysis about package box of aluminum silicon alloy used for microwave module

Hongwei Li, ; Qiantao Cao, ; Zhiming Song,
  • 作者Hongwei Li, ; Qiantao Cao, ; Zhiming Song,
  • 文件大小838.66KB
  • 发表时间2013
  • DOI10.1109/ipfa.2013.6599227
  • 页码578-582
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