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[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Compact electro-thermal models of interconnects
Codecasa, Lorenzo
- 作者Codecasa, Lorenzo
- 文件大小1159.87KB
- 发表时间2013
- DOI10.1109/therminic.2013.6675184
- 页码309-314
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