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[IEEE 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices (RSAMD) - Golden, CO, USA (2013.2.24-2013.2.25)] 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices - Electrical conduction effect on reliability of low-k dielectric in Cu interconnect

[IEEE 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices (RSAMD) - Golden, CO, USA (2013.2.24-2013.2.25)] 2013 IEEE Conference on Reliability Science for Advanced Materials and Devices - Electrical conduction effect on reliability of low-k dielectric in Cu interconnect

Lin, Mingte; Juan, Alex; Su, K. C.

作者Lin, Mingte; Juan, Alex; Su, K. C.
文件大小3228.36KB
发表时间2013
DOI10.1109/rsamd.2013.6647896
页码1-3

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