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Evolution of strain energy during recrystallization of plated Cu films

Evolution of strain energy during recrystallization of plated Cu films

Murray, Conal E.; Rosenberg, R.; Witt, C.; Treger, M.; Noyan, I. C.

期刊名称Journal of Applied Physics
作者Murray, Conal E.; Rosenberg, R.; Witt, C.; Treger, M.; Noyan, I. C.
卷第113卷
期第20期
印刷ISSN0021-8979
文件大小893.07KB
发表时间2013
DOI10.1063/1.4807409

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