Study of Palladium Catalyzation for Electroless Copper Plating on Polyimide Film
Kim, Bin; Jung, Sang Hee; Suh, Seung Wook; Park, Byung Ki
- 期刊名称Journal of Nanoscience and Nanotechnology
- 作者Kim, Bin; Jung, Sang Hee; Suh, Seung Wook; Park, Byung Ki
- 卷第13卷
- 期第1期
- 印刷ISSN1533-4880
- 电子ISSN1533-4899
- 文件大小20504.31KB
- 发表时间2013-01-01
- DOI10.1166/jnn.2013.6933
- 页码517-522