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A Numerical Study of Flow and Temperature Maldistribution in a Parallel Microchannel System for Heat Removal in Microelectronic Devices

A Numerical Study of Flow and Temperature Maldistribution in a Parallel Microchannel System for Heat Removal in Microelectronic Devices

Siva, V. Manoj; Pattamatta, Arvind; Kumar Das, Sarit
  • 期刊名称Journal of Thermal Science and Engineering Applications
  • 作者Siva, V. Manoj; Pattamatta, Arvind; Kumar Das, Sarit
  • 卷第5卷
  • 期第4期
  • 印刷ISSN1948-5085
  • 文件大小1699.21KB
  • 发表时间2013-10-03
  • DOI10.1115/1.4024700
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