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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Comparative Thermal and Energy Analysis of a Hybrid Cooling Data Center With Rear Door Heat Exchangers

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Comparative Thermal and Energy Analysis of a Hybrid Cooling Data Center With Rear Door Heat Exchangers

Gao, Tianyi; Samadiani, Emad; Sammakia, Bahgat; Schmidt, Roger
  • 作者Gao, Tianyi; Samadiani, Emad; Sammakia, Bahgat; Schmidt, Roger
  • 文件大小1909.85KB
  • 发表时间2013
  • DOI10.1115/ipack2013-73101
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