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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions

Taylor, Stephen H.; Garimella, Suresh V.
  • 作者Taylor, Stephen H.; Garimella, Suresh V.
  • 文件大小1962.12KB
  • 发表时间2013
  • DOI10.1115/ipack2013-73283
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