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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - On the Thermal Management Challenges in Next Generation Handheld Devices

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - On the Thermal Management Challenges in Next Generation Handheld Devices

Wagner, Guy R.; Maltz, William

作者Wagner, Guy R.; Maltz, William
文件大小1435.42KB
发表时间2013
DOI10.1115/ipack2013-73237

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