发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Si interposer build-up options and impact on 3D system cost

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Si interposer build-up options and impact on 3D system cost

Velenis, Dimitrios; Detalle, Mikael; Marinissen, Erik Jan; Beyne, Eric

作者Velenis, Dimitrios; Detalle, Mikael; Marinissen, Erik Jan; Beyne, Eric
文件大小588.76KB
发表时间2013
DOI10.1109/3dic.2013.6702367
页码1-5

← 返回【学霸图书馆】主页