SPIE Proceedings [SPIE SPIE Microtechnologies - Grenoble, France (Wednesday 24 April 2013)] Smart Sensors, Actuators, and MEMS VI - Analysis of thermal vias in molded interconnect devices
Reitterer, Jörg; Fidler, Franz; Saint Julien-Wallsee, Ferdinand; Barth, Maximilian; Eberhardt, Wolfgang; Keßler, Ulrich; Kück, Heinz; Schmid, Ulrich; Schmid, Ulrich; Sánchez de Rojas Aldavero, José Luis; Leester-Schaedel, Monika
- 作者Reitterer, Jörg; Fidler, Franz; Saint Julien-Wallsee, Ferdinand; Barth, Maximilian; Eberhardt, Wolfgang; Keßler, Ulrich; Kück, Heinz; Schmid, Ulrich; Schmid, Ulrich; Sánchez de Rojas Aldavero, José Luis; Leester-Schaedel, Monika
- 卷第8763卷
- 印刷ISSN0277-786X
- 文件大小1158.69KB
- 发表时间2013
- DOI10.1117/12.2017361