[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Development of Plate Heat Pipes for the Thermal Management of Power Electronics
- 作者Abe, Yoshiyuki; Nakajima, Akira; Maeda, Yoshihiko; Shimose, Makoto
- 文件大小1411.77KB
- 发表时间2013
- DOI10.1115/ipack2013-73086
[ASME ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference - Buffalo, New York, USA (Sunday 17 August 2014)] Volume 1A: 34th Computers and Information in Engineering Conference - T-Spline Based Local Refinement for Mesh Independent AnalysisBurla, Ravi K.; Kumar, Ashok V. · 2014
[ASME ASME 2014 International Mechanical Engineering Congress and Exposition - Montreal, Quebec, Canada (Friday 14 November 2014)] Volume 2B: Advanced Manufacturing - Mechanical Characteristics and Design of Bolted T-Shape Flange Joints Subjected to Tensile LoadingsSawa, Shunichiro; Omiya, Yuya; Ishimura, Mitsutoshi; Sawa, Toshiyuki · 2014
[ASME ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference - Buffalo, New York, USA (Sunday 17 August 2014)] Volume 4: 19th Design for Manufacturing and the Life Cycle Conference; 8th International Conference on Micro- and Nanosystems - Library of T-Maps for Dimensional and Geometric TolerancesRao, Shyam S.; Haghighi, Payam; Shah, Jami J.; Davidson, Joseph K. · 2014