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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Maximizing Data Center Energy Efficiency by Utilizing New Thermal Management and Acoustic Control Methodology

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Maximizing Data Center Energy Efficiency by Utilizing New Thermal Management and Acoustic Control Methodology

Matteson, Jason A.; Vallury, Aparna; Medlin, Billy
  • 作者Matteson, Jason A.; Vallury, Aparna; Medlin, Billy
  • 文件大小1082.74KB
  • 发表时间2013
  • DOI10.1115/IPACK2013-73134
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