Konsumentenstadt Chicago
- 期刊名称Standort
- 作者Hahn, Barbara
- 卷第38卷
- 期第2期
- 印刷ISSN0174-3635
- 电子ISSN1432-220X
- 文件大小582.69KB
- 发表时间2014-06-14
- DOI10.1007/s00548-014-0328-y
- 页码108-112
Real-time and high accuracy frequency measurements for intermediate frequency narrowband signalsTian, Jing; Meng, Xiaofeng; Nie, Jing; Lin, Liwei · Review of Scientific Instruments · 2018
High-Accuracy Quartz Crystal Resonance Dew Point InstrumentNie, Jing; Meng, Xiaofeng; Lin, Liwei · IEEE Transactions on Industrial Electronics · 2019
Dew point measurement using dual quartz crystal resonator sensorNie, Jing; Liu, Jia; Li, Ning; Meng, Xiaofeng · Sensors and Actuators B: Chemical · 2017
Dew point and relative humidity measurement using a quartz resonant sensorJing Nie,Xiaofeng Meng · 2014
Quartz crystal sensor using direct digital synthesis for dew point measurementNie, Jing; Meng, Xiaofeng; Li, Ning · Measurement · 2017
Fast quartz resonant sensors for high humidity range 60–95% RHNie, Jing; Meng, Xiaofeng; Zheng, Rui; Wang, Shuo · Sensors and Actuators B: Chemical · 2013
High accuracy frequency extraction based on sigma-delta ADC applied in resonant dew point sensorTian, Jing; Meng, Xiaofeng; Nie, Jing; Li, Ning · Measurement · 2018
Dew point fast measurement in organic vapor mixtures using quartz resonant sensorNie, Jing; Liu, Jia; Meng, Xiaofeng · Review of Scientific Instruments · 2017
Optimization of MEMS capacitive accelerometerBenmessaoud, Mourad; Nasreddine, Mekkakia Maaza · Microsystem Technologies · 2013
Novel microstructured evaporation deviceWibel, Wolf; Maikowske, Stefan; Brandner, Juergen J. · Microsystem Technologies · 2015
HAMR HDD shock responsesHuang, Lidu; Suzuki, Kenzi; Huang, Fu-Ying; Hirano, Toshiki; Stipe, Barry · Microsystem Technologies · 2014
Tools for ultrasonic hot embossingLiao, S.; Gerhardy, C.; Sackmann, J.; Schomburg, W. K. · Microsystem Technologies · 2015
ForewordBharat Bhushan · Microsystem Technologies · 2014
Hybrid micro electrostatic actuatorHailu, Zewdu; He, Siyuan; Ben Mrad, Ridha · Microsystem Technologies · 2016
Special issue WaferBond’13Knechtel, Roy; Niklaus, Frank; Michel, Bernd · Microsystem Technologies · 2015
Editorial special issue HARMNST 2013Mohr, Jürgen; Göttert, Jost; Michel, Bernd · Microsystem Technologies · 2014