Investigation on Flow Maldistribution in Parallel Microchannel Systems for Integrated Microelectronic Device Cooling
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Manoj Siva, V.; Pattamatta, Arvind; Das, Sarit Kumar
- 卷第4卷
- 期第3期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小1260.52KB
- 发表时间2014-3
- DOI10.1109/TCPMT.2013.2284291
- 页码438-450
OSHA Compliance IssuesSkolnik, Steve · Journal of Occupational and Environmental Hygiene · 2010
CommentaryJanssen, Larry; Ettinger, Harry; Graham, Stephan; Shaffer, Ronald; Zhuang, Ziqing · Journal of Occupational and Environmental Hygiene · 2013
Case StudyCooper, Michael R.; Susi, Pam; Rempel, David · Journal of Occupational and Environmental Hygiene · 2012
ErgonomicsWilson, Mark D.; McGlothlin, James D.; Rosenthal, Frank S.; Black, David R.; Zimmerman, Neil J.; Bridges, C. David · Journal of Occupational and Environmental Hygiene · 2010
ErgonomicsTorma-Krajewski, Janet; Wiehagen, William; Etcheverry, Ann; Turin, Fred; Unger, Richard · Journal of Occupational and Environmental Hygiene · 2009
Engineering Case ReportYasui, Shojiro · Journal of Occupational and Environmental Hygiene · 2013
Case StudyKurtz, Lawrence A.; Vi, Peter; Verma, Dave K. · Journal of Occupational and Environmental Hygiene · 2012
ErgonomicsMalkin, Robert; Hudock, Stephen D.; Hayden, Charles; Lentz, Thomas J.; Topmiller, Jennifer; Niemeier, Richard W. · Journal of Occupational and Environmental Hygiene · 2005